P3 Plenary Speech III - Dr. Beth Keser, iMAPS
Oct. 27, 2023 09:00 AM - 09:40 AM
Room: R504a
Session chair： Kuo-Ning Chiang, Chair Professor, NTHU
|
P4 Plenary Speech IV -Prof. Takayuki Ohba, Tokyo Institute of Technology
Oct. 27, 2023 09:40 AM - 10:20 AM
Room: R504a
Session chair： Shin-Puu Jeng, Director , TSMC
|
S21 Market Trend：Innovative Packaging Technology Applied in AR/VR, AI, and ESG
Oct. 27, 2023 10:30 AM - 12:30 PM
Room: R504a
Session chair： Albert Lan, Applied Material
|
S22 Thermal Modeling &Characterization
Oct. 27, 2023 10:30 AM - 12:30 PM
Room: R504b
Session chair： Samy Lin, Intel ; Lin, Wei-Keng, NTHU
|
S23 High Speed Signal & Interconnect
Oct. 27, 2023 10:30 AM - 12:30 PM
Room: R504c
Session chair： Po-Hao Tsai, DUPONT;Shu Huang ,ITRI
|
S24 Advanced PCB/Substrate & Soldering
Oct. 27, 2023 10:30 AM - 12:30 PM
Room: R503
Session chair： Carl E. Chiang, TPCA/ Ra-Min Tain, Manager, Unimocron
|
S25 JIEP
Oct. 27, 2023 13:30 PM - 16:00 PM
Room: R504a
Session chair： Takeyasu Saito, Osaka Metropolitan University / Yuki Ishikawa, Sanyu rec co., ltd.
|
S26 Design, Modeling &Testing
Oct. 27, 2023 13:30 PM - 16:00 PM
Room: R504b
Session chair： Ben-Je Lwo, Professor, NDU/ Cadmus Yuan, FCU
|
S27 Advanced Packaging & Material Characterization
Oct. 27, 2023 13:30 PM - 16:00 PM
Room: R504c
Session chair： C.Y.Huang, VP, Senju/ Jenn-Ming Song, Professor, NCHU
|
S28 HDI & FPC Technologies
Oct. 27, 2023 13:30 PM - 16:00 PM
Room: R503
Session chair： Michael Chang, DuPont Taiwan Limited/ Chien-Lung Liang, Professor, NTUST
|