Bio:
Dr. Andrew Tay is currently an Adjunct Professor in the Department of Electrical and Computer Engineering, National University of Singapore (NUS) and a Visiting Scientist at the Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE), NUS. Prior to this he was a Professor of Mechanical Engineering at NUS. He obtained his B.E. (Hons I and University Medal) and PhD in Mechanical Engineering from the University of New South Wales, Australia. His research interests include electronics packaging (thermo-mechanical failures, delamination, effects of moisture, solder joint reliability); thermal management of electronic systems and EV batteries, infrared and thermo-reflectance thermography, solar photovoltaics reliability, and fracture mechanics.
He is currently a member of the Board of Governors of the IEEE Electronics Packaging Society (EPS), the EPS Director of Chapter Programs, and a Distinguished Lecturer of EPS. He was the inaugural General Chair of the 1st Electronics Packaging Technology Conference (EPTC) in 1997 and currently the Chairman of the EPTC Board. He was awarded the 2019 IEEE EPS David Feldman Outstanding Contribution Award, the 2012 IEEE CPMT Exceptional Technical Achievement Award, and the 2012 IEEE CPMT Regional Contributions Award. For his outstanding contributions in the application of engineering mechanics to electronics and/or photonics packaging, he was awarded the ASME EPPD Engineering Mechanics Award in 2004. He was also awarded an IEEE Third Millennium Medal in 2000. He is a Fellow of ASME and a Life Fellow of IEEE.
Abstract:
Shrinking features and growing device complexity in today’s advanced devices have led to increased challenges in characterizing the thermal behaviour of these devices and their failure. With higher power densities, having a full understanding of the static and dynamic thermal behaviour of the devices is essential for ensuring optimal trade-offs between performance and device reliability. With sub-micron devices, the challenge is even greater as high spatial and temporal resolutions are required. In this presentation, some of the latest techniques of thermal analysis will be described and compared. Two popular non-contacting techniques will be dealt with in greater detail. It was found that thermoreflectance thermography can best meet the challenges imposed by these advanced devices by providing sub-micron spatial resolution and temporal resolution in the picosecond range. When failures occur in a device, a hot spots are usually generated. Thermal analysis can be used to determine the location of hot spots and hence aid in the failure analysis of the device. It can also help to characterize the thermal behaviour, thermal properties, and the thickness of thin films in the device in situ and non-destructively. Using a novel quantum spin crossover
(SCO) material, electromagnetic power intensity can be correlated with temperature. Hence,via a SCO coating, a thermal imaging system can be adapted to characterize the electromagnetic power intensity field of antennas in a much quicker and cheaper manner than current methods. Several case studies will be presented.