Sessions Index

S16 【S16】Bonding, Dielectric Materials and Laser-Material Interactions

Oct. 22, 2025 10:10 AM - 12:10 PM

Room: 501, TaiNEX 1
Session chair: Irving Lee/Rational Precision Industry Co., Ltd., Peter Chang/MacDermid Alpha Electronics Solutions

EMC Solutions Aligned with AI-Driven High-Speed/ High-Frequency Material Trends
發表編號:S16-1時間:10:10 - 10:40

Invited Speaker

Speaker: Assistant Manager, Chieh-Sen Lee, Elite Material Co


Bio:

Chieh-Sen Lee received the Ph.D. degree in Electrical Engineering from National Cheng Kung University in Tainan, Taiwan, in 2015. He joined Elite Material Co., Ltd in Taiwan as an Assistant Manager in 2022, where he has been involved in projects related to CCL (Copper Clad Laminate) materials for signal integrity analysis, high-speed circuit design for commercial products, and the development of signal integrity test vehicles for high-frequency operations. He has published over 10 IEEE Transactions Journal papers as the first author on topics related to microwave technology.



Abstract:





AI Driving Demand for CCL Materials 


EMC’s Technology-Aligned CCL Portfolio 


Key Design Parameter : Dk


AI-Driven Performance Leader : EM-896 Series




 


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