Sessions Index

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In the last 25 years, Chip Package Interaction (CPI) has grown from infancy to necessary consideration for any advanced Si packaging and assembly. The early days saw packaging as an afterthought to protect the valuable high-technology chip. The landscape has clearly changed with Advanced Packaging product architectures bringing raw product performance. Today, advancements in 3DIC’s require broad consideration of substrates, materials, package layout, assembly thermomechanical, and electrical wear out factors to ensure product performance and reliability.

  Dr. Shin-Puu Jeng currently serves as Vice President of Technology for Heterogeneous Integration Products at Applied Materials. Prior to joining Applied Materials, he was a Director in the New Technology and System Integration, 3DIC, and Special ASIC Divisions at TSMC.
  He received the National Industrial Innovation Award from Taiwan’s Ministry of Economic Affairs and the Outstanding Engineer Award from the Chinese Institute of Engineers (Taiwan) for his contributions to the development of TSMC’s industry-leading CoWoS technology.   He also received TSMC’s Prolific Inventor Award and Best Disclosure Award.
Dr. Jeng has 676 USPTO granted patents, more than 120 conference and journal papers and a long list of awards and professional society affiliations. He received his Ph.D from the University of Florida and conducted his postdoctoral studies at Yale University.

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In this presentation, I will provide an overview of current trends in advanced packaging technologies. Drawing on my personal experience transitioning from a foundry to an equipment company, I will share insights into how different sectors within the ecosystem contribute to technology development. In particular, I will discuss the importance of cross-disciplinary collaboration, especially amongfoundries/OSATs, equipment makers, and material suppliers.

Chieh-Ju Li is the R&D chemist for the electroplating segment at Qnity™, DuPont Electronics. With over eight years of experience in the semiconductor industry, he possesses strong technical and process engineering expertise. Drawing on his experience at TSMC, he has developed critical problem-solving skills that encompass a systematic approach: starting with observation, followed by analysis, hypothesis formulation, and ultimately verification.
Chieh-Ju joined DuPont in 2022 as a scientist and took the lead in developing through-hole conformal plating. In August 2023, he also assumed responsibility for the via-filling copper application. By 2025, his via-filling product successfully penetrated the HDI market, gaining acceptance from customers in China and gradually becoming a staple on their production lines. Currently, he is managing increased customer engagements.
Simultaneously, at the end of 2024, he initiated a new product development project. This promising product has the potential to revolutionize the IC substrate market, achieving exceptional X-via-filling performance with a one-bath solution. It aims to maximize production efficiency while providing greater flexibility in the production arrangements within the PCB industry.
He earned both his Bachelor's and Master’s degrees in Materials Science and Engineering from National Tsing Hua University (NTHU).

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With the rapid advancement of high-tech applications such as 5G networks, artificial intelligence, and automotives, the importance of the PCB industry is becoming increasingly apparent. Among these developments, Flip Chip-Chip Scale Package (FC-CSP) technology stands out as a critical driver of innovation. In particular, the hottest topic in the semiconductor field today—IC substrates—features complex structures, where the quality of through-hole filling plays a pivotal role in determining the speed and efficiency of electronic signal transmission. Therefore, the industry is in urgent need of advanced electroplating solutions to meet the demands of next-generation technologies.With the rapid advancement of high-tech applications such as 5G networks, artificial intelligence, and automotives, the importance of the PCB industry is becoming increasingly apparent. Among these developments, Flip Chip-Chip Scale Package (FC-CSP) technology stands out as a critical driver of innovation. In particular, the hottest topic in the semiconductor field today—IC substrates—features complex structures, where the quality of through-hole filling plays a pivotal role in determining the speed and efficiency of electronic signal transmission. Therefore, the industry is in urgent need of advanced electroplating solutions to meet the demands of next-generation technologies.
     At this year’s TPCA Show, we are proud to present our newly developed high-performance copper electroplating formulation designed specifically for FC-CSP applications with a focus on through-hole filling. Our research centers on through-hole filling with one-bath, not only maximize production efficiency but also create flexibility for productive arrangements in PCB factory. By employing Design of Experiments (DOE), electrochemical analysis, and plating validation techniques, we have successfully developed an innovative copper additive system. This formulation features proprietary organic additives that deliver outstanding performance.Moreover, our solution offers simplified bath maintenance, helping manufacturers reduce operational complexity and cost—an increasingly critical factor in today’s competitive PCB market. 

Michael Chang, Business Development Consultant for Qnity™, DuPont Electronics, brings over 25 years of experience in high-performance film materials for flexible printed circuits (FPC) and advanced packaging applications. With a Master’s in Material Science from National Cheng Kung University (NCKU) and an MBA from National Chengchi University (NCCU), he combines deep technical knowledge with strong business acumen.
As a Business Development Consultant since 2016, Michael focuses on low-Dk PI films for 5G/6G, colorless polyimide (PI) films for flexible displays, and materials enabling electric vehicles. He previously led APAC sales and marketing for PI films (2004–2016) and provided technical support for polyester and PI applications (1997–2004).
Michael is a trusted partner to companies seeking advanced material solutions for next-generation electronics.

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As artificial intelligence (AI) applications continue to evolve across both cloud and edge platforms, the hardware demands behind them are rapidly intensifying. High data throughput, efficient thermal management, and space-conscious design are now essential in the development of next-generation servers, AI accelerators, edge devices, and wearables. These demands have driven a renewed focus on advanced flexible interconnects, where material selection is becoming just as critical as circuit design. Kapton ® polyimide (PI) films have emerged as a foundational material in this transformation. Known for their outstanding thermal stability, chemical resistance, electrical insulation, and mechanical durability, Kapton ® films are widely adopted in the production of flexible copper clad laminates (FCCLs) and high-density flexible printed circuits (FPCs). These films are proving critical in high- reliability applications where AI computing modules must withstand repeated thermal cycling, tight bend radii, and increasingly compact footprints.
This presentation is designed specifically for FPC shop engineers and OEM engineers involved in the manufacturing and design integration of flexible electronics for AI systems. It will explore the key performance advantages of Kapton ® PI films in FCCL constructions, highlighting their role in improving lamination quality, signal integrity, dimensional stability, and laser/chemical process compatibility. We will examine the full process chain—from lamination to drilling, etching, and testing—along with design rules and material considerations that help mitigate defects and ensure long-term reliability.
Real-world case studies will showcase the deployment of Kapton ® -based FPCs in cloud server hardware, edge AI modules, and wearable devices. From managing heat in GPU accelerator boards to enabling ultra-thin flexible connections in AIoT sensors, Kapton ® PI plays a critical role in meeting both performance and production requirements.