Oral Sessions

Plenary Speech I 701EF, TaiNEX 2 10:20 - 11:10 Yasumitsu Orii, Rapidus

Plenary Speech II 701EF, TaiNEX 2 11:10 - 12:00 Shin-Puu Jeng, TSMC

Intel - Ecosystem Enabling for Intel Data Center AI Server Solutions 504A, TaiNEX 1 13:30 - 15:30 Jimmy Hsu, intel / George Chen, intel

MKS’ Atotech - Advancing AI chips from silicon to PCB 504B, TaiNEX 1 13:30 - 15:30 Eddy Chen, MKS’ Atotech

Advanced Packaging Technologies-1 504C, TaiNEX 1 13:30 - 15:30 Andrew Tay, National Singapore University / Ming-Yi Tsai, Chang Gung University

Design, Modeling, AI/Machine Learning Applications, and Testing -1 503, TaiNEX 1 13:30 - 15:30 Dongkai Shangguan, Indium Corp. / Sheng-Jye Hwang, National Cheng Kung University

Sustainable Technologies & Systems 502, TaiNEX 1 13:30 - 15:30 Alex King, Taimide Tech. Inc. / Kuo-Chan Chiou, ITRI

AMD - Server Solution Customer SI+EV Enablement 504A, TaiNEX 1 16:00 - 18:00 Hellen Lo, AMD / YL Li, AMD

JIEP- Topics for advanced packaging processes in Japan 504B, TaiNEX 1 16:00 - 18:00 Takeyasu  Saito, Osaka Metropolitan University / Yuki Ishikawa, Sanyu rec Co.,Ltd

Advanced Packaging Technologies-2 504C, TaiNEX 1 16:00 - 18:00 Andreas Ostmann, Fraunhofer IZM / Shih-Kang Lin, National Cheng Kung University

HDI, IC Substrate and FPC Technology-1 503, TaiNEX 1 16:00 - 18:00 Yu-Hua Chen, Unimicron / Nishimura Yoshio, Ajinomoto Co., Inc.

Power Electronics Packaging-1 502, TaiNEX 1 16:00 - 18:00 Li-Cheng Shen, USI / Chi-Chuan Wang, National Yang Ming Chiao Tung University

Plenary III 504, TaiNEX 1 09:00 - 09:50 Kuo-Ning Chaing, NTHU

Plenary IV 504, TaiNEX 1 09:50 - 10:40 Wei-Chung Lo, ITRI

IEEE EPS Panel - Heterogeneous Integration Roadmap Compact Session 504AB, TaiNEX 1 10:40 - 12:10 CP Hung, ASE Group

DUPONT - Shaping Our Future with AI by Next-Gen Substrate and Packaging 504A, TaiNEX 1 13:30 - 15:30 Lucy Wei, DUPONT / Jason Chuang, DUPONT

Market trend-Innovative 3D IC Heterogeneous Integration Packaging 504B, TaiNEX 1 13:30 - 15:30 Albert Lan, Applied Materials

ICEP 504C, TaiNEX 1 13:30 - 15:30 Yasumitsu Orii, Rapidus /Yasuhiro morikawa, ULVAC, Inc

Advanced Packaging Technologies-3 503, TaiNEX 1 13:30 - 15:30 Po-Hao Tsai, Applied Materials / Haley Fu, iNEMI

Design, Modeling, AI/Machine Learning Applications, and Testing -2 502, TaiNEX 1 13:30 - 15:30 Meng-Kai Shih, National Sun Yat-sen University / Shu-Shen Yeh, Google

SPIL- Advanced Packaging 504A, TaiNEX 1 16:00 - 18:00 Yu Po Wang, SPIL /Kuo Ming Chen, UMC

SMTA 504B, TaiNEX 1 16:00 - 18:00 Jeffrey Lee, Integrated Service Technology Inc.

Power Electronics Packaging-2 504C, TaiNEX 1 16:00 - 18:00 Chun-Kai Liu, ITRI / Chang-Chun Lee, National Tsing Hua University

Advanced and Green Materials and Process-1 503, TaiNEX 1 16:00 - 18:00 Jason Lee, Boardtek Electronics / Carl E. Chiang, TPCA

Test, Quality, Inspection and Reliability / Simulation 502, TaiNEX 1 16:00 - 18:00 Ben-Je Lwo, National Defense University / De-Shin Liu, NCCU

ISMP 504A, TaiNEX 1 08:20 - 10:20 Taek-Soo Kim, KAIST/ Woosung Park, Hanyang University

Glass Substrate 504B, TaiNEX 1 08:20 - 10:20 ONISHI Tetsuya, Grand Joint technology

Interconnections & Nanotechnology 504C, TaiNEX 1 08:20 - 10:20 Takayuki Ohba, Institute of Science Tokyo / Chien-Lung Liang, NTUST

HDI, IC Substrate and FPC Technology-2 503, TaiNEX 1 08:20 - 10:20 Dyi-Chung Hu, Siplus / Michael Chang, Dupont

Advanced Materials, Automatic Process & Assembly 502, TaiNEX 1 08:20 - 10:35 Ting-Li Yang, Mediatek / Fan-Yi Ouyang, NTHU

Heterogeneous Integration 504A, TaiNEX 1 10:30 - 13:00 Shin-Puu Jeng, TSMC/Kathy Yan, TSMC

Advanced Packaging Technologies-4 504B, TaiNEX 1 10:30 - 12:30 Lih-Shan Chen, I-Shou University / Myongchun Koh, Taiyo Ink MFG. Co., Ltd

Design, Modeling, AI/Machine Learning Applications, and Testing / Smart manufacturing 504C, TaiNEX 1 10:30 - 12:30 Yu-Jung Huang, I-Shou University / Rozalia Beica, Rapidus

Advanced and Green Materials and Process-2 503, TaiNEX 1 10:30 - 12:30 Jenn-Ming Song, National Chung Hsing University / Simon Kuo, Cymmetrik

Test, Quality, Inspection and Reliability / Smatt Manufacturing 502, TaiNEX 1 10:30 - 12:30 Jimmy Hsu, Intel Corporation / Kuan-Jung Chung, National Changhua University of Education

3D embedding technology toward heterogeneous integration 504A, TaiNEX 1 13:30 - 15:30 Weita Yang, ITRI / Yoshihisa Katoh,FUKUOKA-University

Design, Modeling, Al/Machine Learning Applications, and Testing /Advanced Process 504B, TaiNEX 1 13:30 - 15:30 Tz-Cheng Chiu, National Cheng Kung University /Lewis Huang, Senju Electronic (Taiwan) Co.,Ltd

Interconnections & Nanotechnology & Advanced Materials, Automatic Process & Assembly 504C, TaiNEX 1 13:30 - 15:30 Chih Hang Tung, TSMC / Cheng-En Ho, Yuan Ze University